In an era of cutthroat technological rivalry, China's unveiling of 12-inch wafers made from 2D materials is a monumental advancement, one that challenges the traditional silicon-based semiconductor industry led primarily by the U.S. and supported by the EU.
Developed by scientists from Peking University, Renmin University, and the Chinese Academy of Sciences, these atom-thin wafers promise exceptional semiconductor properties and low production costs.
In collaboration with Professor Liu Can at Renmin University of China and Professor Zhang Guangyu at the Chinese Academy of Sciences, his team developed the manufacturing strategy in Beijing and verified it at Songshan Lake Materials Laboratory, Dongguan.
They published a paper of their findings in the peer-reviewed journal Science Bulletin on July 30. Though silicon is well-suited for semiconductor processing, current silicon chips have met difficulties as device sizes continue to decrease.
The work represents not just scientific innovation but also a calculated geopolitical move. It stands as a direct counter to Western policies like the Biden administration's Chip Act, designed to limit China's access to cutting-edge semiconductor technologies. This achievement, therefore, fortifies China's R&D resilience in an industry critical to its technological ambitions.
“When silicon transistors are made thinner, their control of voltage becomes worse. Current will exist even when the device is not working. This brings extra energy costs and heat generation,” Liu said.
The 2D material consists of crystalline solids with one to several layers of atoms. The wafers’ unique physical properties, due to their naturally atomic-level thickness, could solve the problem. And there could be applications in many high-performance electronic devices.
“A transistor built from a single layer of MoS2, [a typical 2D material] with a thickness of about one nanometre, outperforms the one made with the same thickness of silicon many times,” Liu said.
They developed a "surface-to-surface" supply method that ensures uniform wafer growth, making large-scale, high-capacity production feasible.
Yet, transitioning from these groundbreaking wafers to operational chips is a complex undertaking. Tailoring existing microfabrication techniques like photolithography to these new materials is essential. Leading semiconductor companies like TSMC, Intel, and Samsung, who are investing heavily in R&D, will be key players in this transitional phase.
China's advancements in 2D semiconductors are not just a national affair; they have global implications. As the U.S. focuses on securing its tech supply chains and the EU grapples with its technological strategy, China's strides could potentially redraw the lines of semiconductor dominance worldwide.
While the wafers have been successfully fabricated, transforming them into usable chips still requires intricate design and engraving like photolithography and deposition. Yet, Liu is confident about the future:
“As the history of the semiconductor industry has shown, iteration is key, and some hurdles are likely to be overcome with industrial refinement”
In the forthcoming years, experts in both academia and the semiconductor industry are likely to view China's 2023 advancements in 2D semiconductor technology as a pivotal milestone. This breakthrough not only exemplifies China's ability to innovate despite geopolitical restrictions but also positions the country as an emerging leader in a sector critical to contemporary life and business. Given its potential to significantly influence both technological trajectories and geopolitical dynamics, this development warrants close attention from global stakeholders.
